In-plane thermal conductivity of sub-20 nm thick suspended mono-crystalline Si layers

TítuloIn-plane thermal conductivity of sub-20 nm thick suspended mono-crystalline Si layers
Tipo de publicaciónJournal Article
Año de publicación2014
AutoresFerrando-Villalba, P, Lopeandia, AF, Abad, L, Llobet, J, Molina-Ruiz, M, Garcia, G, Gerbolès, M, Alvarez, FX, Goñi, AR, Muñoz-Pascual, FJ, Rodríguez-Viejo, J
JournalNanotechnology
Volume25
Issue18
Páginas185402
Resumen

We measure the thermal conductivity of a 17.5-nm-thick single crystalline Si layer by using a suspended structure developed from a silicon-on-insulator wafer, in which the Si layer bridges the suspended platforms. The obtained value of 19 Wm −1 K −1 at room temperature represents a tenfold reduction with respect to bulk Si. This design paves the way for subsequent lateral nanostructuration of the layer with lithographic techniques, to define different geometries such as Si nanowires, nanostrips or phononic grids. As a proof of concept, nanostrips of 0.5 × 10 μ m have been defined by focused ion beam (FIB) in the ultrathin Si layer. After the FIB cutting process with Ga ions at 30 kV and 100 pA, the measured thermal conductivity dramatically decreased to 1.7 Wm −1 K −1 , indicating that the structure became severely damaged (amorphous). Re-crystallization of the structure was promoted by laser annealing while monitoring the Raman spectra. The thermal conductivity of the layer increased again to a value of 9.5 Wm −1 K −1 at room temperature, below that of the single crystalline material due to phonon scattering at the grain boundaries.

URLhttp://stacks.iop.org/0957-4484/25/i=18/a=185402
DOI10.1088/0957-4484/25/18/185402
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