High Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer.

TitleHigh Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer.
Publication TypeJournal Article
Year of Publication2018
JournalMicromachines
Volume9
Start Page579
Issue11
Campus d'excel·lència internacional U A B